XIAO ESP32S3 & Wio-SX1262 Kit w/ 3D Case for Meshtastic & LoRa

• XIAO ESP32S3 & Wio-SX1262 Kit w/ 3D Case for Meshtastic & LoRa
• Features a dual-core ESP32S3 processor
• Supports LoRa, Wi-Fi, and BLE 5.0
• Includes a robust 3D black ABS case
• Offers extensive connectivity options
• Works in extreme temperatures

The XIAO ESP32S3 & Wio-SX1262 Kit w/ 3D Case for Meshtastic & LoRa is a sophisticated device featuring an XIAO ESP32S3 and Wio-SX1262 LoRa module, housed in a 3D-printed black ABS casing. It supports a wide frequency range of 868- 915MHz and includes a 2dBi gain external antenna, facilitating communication over distances of 2 to 5 kilometers for LoRa and over 100 meters for Wi-Fi/BLE.

Pre-flashed with LoRa single-channel gateway firmware, it is compatible with the SenseCraft app and can be used for Meshtastic communication. The device is powered by an ESP32S3 32-bit, dual-core processor, supporting multiple development environments such as Arduino and MicroPython. It includes a Type-C USB interface and offers extensive connectivity options through GPIO, I2C, and UART interfaces, along with lithium battery charge management.

The compact design, measuring 22 x 22 x 60 mm, is suitable for outdoor and space-constrained projects, withstanding temperatures from -40 to 100 °C. This versatile hardware can be developed into a node or router for Meshtastic, a LoRaWAN gateway, or a LoRa sensor.